이미지3

pcb

  • HDI
  • >
  • Package Substrate
  • >
  • Flex/Rigid-Flex
  • >
  • Backplane
  • >
  • Probecard
  • >
  • Heatsink and Metal Core
  • >
  • Heavy Copper
  • >
  • RF/Microwave
  • >
  • HOME > PCB > Heatsink and Metal Core
  • Heatsink and Metal Core
Whether using aluminum or other thermal interface materials to provide the necessary thermal management,
SEP has the experience in the design and fabrication of heatsink and metal core PCB's to support your requirements.
  • Feature
  • 타이틀라인
Heatsink and Metal CoreB
  • 아이콘 Lower Operating Temperatures
  • 아이콘 Improved Product Durability
  • 아이콘 Increased Power Density
  • 아이콘 Increased Thermal Efficiency
  • 아이콘 Lower Junction Temperatures
  • 아이콘 Minimize Thermal Impedance
  • Specifications
  • 타이틀라인
Item Specifications
Material FR4, Aluminum
Layer count Max 4
Line and Space 0.100mm / 0.100mm
Board Thickness Max 3.2mm
Min Hole Size 0.200mm
  • Applications타이틀라인
  • application
  • 아이콘 LED backlight
  • 아이콘 Motor Drives
  • 아이콘 Solid State Relays
  • 아이콘 Power Conversion