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  • HOME > PCB > Package Substrate
  • Package Substrate
Package Substrate
  • Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
  • Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
타이틀아이콘FC-CSP (Flip Chip) CSP
Flip Chip CSP (FC CSP) utilizes flip chip bumping technology instead of wire bonding to connect the bump pads on the substrate directly to the bonding pads of the chip. With the high density layout and smaller package size, this technology provides cost reductions.
  • Feature
  • 타이틀라인
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  • 아이콘 High I/O Count and Short Interconnects.
  • 아이콘 High layout density.
  • 아이콘 Cost reduction due to smaller package size.
  • 아이콘 Fine pattern & Fine Bump Pitch
  • 아이콘 Tight solder resist position tolerance
  • 아이콘 Flip Chip Bumping Technology
  • Specifications
  • 타이틀라인
Item Specifications
Material BT Resin
Layer count 2~8
Line and Space 0.020mm / 0.020mm
Bump Pitch 0.15mm
Micro Via and Land 0.065mm / 0.135mm
  • Applications
  • 타이틀라인
  • application
  • 아이콘 Mobile Application Processor
  • 아이콘 Baseband
  • 아이콘 SRAM, DRAM, Flash Memory