이미지3

pcb

  • HDI
  • >
  • Package Substrate
  • >
  • Flex/Rigid-Flex
  • >
  • Backplane
  • >
  • Probecard
  • >
  • Heatsink and Metal Core
  • >
  • Heavy Copper
  • >
  • RF/Microwave
  • >
  • HOME > PCB > Package Substrate
  • Package Substrate
Package Substrate
  • Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
  • Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
타이틀아이콘CSP (Chip Scale Packages)
Chip Scale Packaging (CSP) utilizes fine pattern technology, very small via's, ultra thin copper foil and build up structure for high density designs and flexibility. The CSP substrate provides high reliability in both connection and isolation.
  • Feature
  • 타이틀라인
image1
image2
image3
  • 아이콘 Fine patterning technology for high density design
  • 아이콘 Build up structure for high design flexibility
  • 아이콘 High reliability in connection and isolation
  • 아이콘 Adoption of low CTE material suitable for PoP
  • Specifications
  • 타이틀라인
Item Specifications
Material BT Resin
Layer count 2~6
Line and Space 0.020mm / 0.020mm
Package Size 3x3mm ~ 19x19mm
Board Thickness 0.13mm
  • Applications
  • 타이틀라인
  • application
  • 아이콘 Digital Baseband
  • 아이콘 Graphic Processor
  • 아이콘 Multimedia Controller
  • 아이콘 Application Processor