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- HOME > PCB > HDI
- HDI
- SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's.
- Through our endless effort, we can meet any design requirement of the small form factors that apply to the latest product applications,
such as, mobile device, tablet PC and other high technology products. - The list below shows SEP's entire features of HDI technology.
- Feature
Fine line, microvia and registration technologies- i+N+i (i≥2) build up structure
- Stacked and/or staggered copper filled via
- Via in pad
- Sequential Lamination
- Buried Capacitance
- High Tech Drilling Capability – Small hole drilling, Backdrilling
- Lower Dk / Df material enables better signal transmission
performance - Qualified material and surface treatment for Lead-free process
- Controlled Impedance (+/- 10% Standard - +/- 7% Advanced)
- Edge Plating for Shielding Space Optimization and Assembly
- Thin board capabilities
- Specifications
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- Applications
- Smart Phone
- Tablet PC
- Game Console
- Network Server
- Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
Copyright⒞ 2013 SEP Co., Ltd. All rights reserved.
