• HDI
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  • SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's.
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  • Package Substrate
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  • Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
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  • Rigid-Flexible
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  • For over 10 years, SEP has been producing single to multilayer constructions of both Flexible and Rigid-Flexible circuits. We have a core flex circuit engineering team that supports the latest in...
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  • BACKPLANE
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  • With our combined backplane and assembly capabilities, SEP is structured to provide custom backplane solutions that deliver performance and overall value. Our key capabilities include ...
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  • Probecard
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  • SEP has an extensive background in producing technically advanced, high quality probe cards and tester interfaces. We have been supporting the Automatic Test Equipment (ATE) business ...
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  • Heatsink and Metal Core
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  • Whether using aluminum or other thermal interface materials to provide the necessary thermal management, SEP has the experience in the design and fabrication of heatsink ...
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  • Heavy Copper
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  • Heavy copper can be used in a PCB for a variety of purposes, including high power distribution, heat dissipation, planar transformers, and power convertors.
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  • RF/Microwave
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  • SEP has considerable technical knowledge and 15 years manufacturing experience in the supply of complex microwave PTFE and mixed dielectric multilayer PCBs.
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